The cutting devices researched and developed for transparent brittle materials consist of picosecond laser cutting, CO2 laser splitting and automatic material loading and unloading. The picosecond laser beams pass through laser shredding cutting heads focusing on materials for perforation, and coordinate with X/Y high speed platforms to move at the highest speed to 300mm/s to form the required cutting lines. CO2 laser is used to heat the cutting lines. The principle of expansion on heating and contraction on cooling is used to actually seperate products with wastes quickly. After seperation, the edge breakage of the products is at <5um, and strength is even higher. They are especially suitable to cutting on transparent brittle materials such as sapphire, toughened or non-toughened glass.
Transparent Brittle Material
Precision Laser Cutting Machines
It is the cutting machine with double optic path and double galvanometer cutting heads built using imported high power picosecond laser through spectral components after two beams of laser at the same power are split at the scale of 1:1. It makes the most of the advantages such as narrow pulse width of picosecond laser, high pulse energy and low thermal effect zone, and is widely used in fine cutting, drilling and groove digging of brittle materials such as sapphire, glass, silicon wafers, and ceramic wafers. It is provided with fully automatic loading and unloading manipulators, which greatly increase the productivity and reduce manual labor. Only one person is needed to operate several set of devices.
Precision Laser Cutting Machine Series
for Sapphire, Ceramics and Metals
The cutting machines perform cutting of sapphire, ceramics and metals using nano picosecond optic fiber laser. They have advantages such as low prices, smooth cut side walls, minimum edge breakage 10um and quicker cutting speed than traditional tools.
The laser cutting machines specially developed by Hymson Laser Technology for cutting sapphire, glass, ceramics and metals function as cutting contours, drilling and line drawing, and can also peform cutting, drilling and line drawing for other different kinds of brittle materials. The cutting speed is quicker, and there are double heads and single heads for cutting heads. The selection of double cutting heads can greatly improve the production effeciency.
Laser Precision Cutting
This machine can cut PCB boards using ultra-violet laser. It has cutting line width at <30 microns, and the cutting side walls are smooth without cutting carbonization having relatively low stress and thermal effect. The laser cutting machines specially developed for circuit boards by Hymson Laser Technology have functions as cutting, drilling, groove digging and window opening. They can cut materials such as soft boards, cover films and multiplayer boards with more rapid cutting speed, which can greatly increase productivity. There is cutting equipment at high accuracy and high repetition with advantages of high results and low costs, which can greatly improve the industrial competence of the enterprise.
3D Contour Precision
Laser Cutting Machines
This machine model is used to perform micro machining of precision parts and components such as ceramics, aluminum alloy, carbon steel, stainless steel, titanium alloy, copper, and liquid metals, etc using nano QCW optic fiber laser. It is widely used in the part and component industries with 3D surface cutting such as mobile phone cases. The 3D precision laser cutting machines specially developed for precision part cutting have the functions as contour cutting, drilling and line drawing.